Senior Engineer Microelectronic Packaging

About Fingerprint Cards AB
Fingerprint Cards AB (FPC) is a Swedish biometric company with headquarters in Gothenburg that markets develops and produces biometric components and technologies that through the analysis and matching of an individual’s unique fingerprint verify the person’s identity. The technology consists of biometric sensors, processors, algorithms and modules. FPC engages around 300 dedicated people at offices in Gothenburg, Malmö, Linköping, Copenhagen, Tokyo, Seoul, Shanghai, Taipei and Silicon Valley. FPC shares are noted on Nasdaq OMX Stockholm.

At FPC you will be working with the latest technology in a dynamic international environment, in a company under rapid development. You will be empowered with responsibilities and decision paths are short and fast. Our people are engaged and each individual is important since our joint efforts contribute to our success. www.fingerprints.com

FPC is a global leader in capacitive fingerprint sensing technology. FPC designs entire biometric systems, comprised of advanced custom silicon devices, microelectronic packaging, algorithms and software for user verification and identification.

 

FPC is now looking for an experienced engineer to strengthen our R&D team within the field of flexible and bendable fingerprint sensor products. The main target products for such novel microelectronic packages are primarily wearable consumer electronics and smart cards. Both regarded as key markets to enable FPC’s long term roadmap goals and a continuous profitable growth and expansion of the company.

 

You will become a part of the Microelectronic Packaging Department, which is one of four R&D departments at FPC. Specifically, within the Microelectronic Packaging Department, you will work in the Technical Programs Team, which is a team dedicated towards next generation semiconductor packages for capacitive fingerprint sensors.

 

About the Position

The position will entail R&D within the field of flexible electronics in general and flexible semiconductor packaging in particular. You will be responsible for setting long terms technical goals for flexible hybrid packaging technologies for FPC’s fingerprint sensors. In this new and rapidly progressing industry, you will closely monitor trends both in academia and industry.

 You are expected to propose, initiate and lead technical studies and projects that are aimed at evaluating performance and reliability of promising technologies, materials and/or production processes within the above mentioned field. In the projects you will be supported by highly skilled team members within simulation, reliability and device characterization, but you are also expected to perform some hands-on work in FPC’s laboratories as well as on-site at FPC’s research partners or manufacturing sites. As the position will entail communication with many stakeholders, you must be able to convey complex technical information effectively to people with different professional and cultural backgrounds, internally and externally.

 The preferred work location is at FPC headquarters in Gothenburg, Sweden. However, other work locations may be considered for the right candidate. A willingness to travel international (including intercontinental) is a must.

 

Your Background

• Education: Ph.D or M.Sc in Electronics, Chemistry, Physics or equivalent.
• More than 5 years experience within semiconductor packaging from academia and/or industry
• Experience within the field of flexible hybrid electronics and/or flexible electronics will be considered as a strong merit
• Knowledge and work experience with matters regarding intellectual property will be considered as a merit


In order to succeed in this role you need to be:

• Innovation driven
• Have a strong personal drive to accomplish agreed upon project goals
• Willing to take on responsibility and take initiatives for proposing technical projects/studies
• Be comfortable working in a rapidly growing company, where you will be expected to assume considerable personal responsibility for your own activities and the company’s overall success.
• Being a team player who contributes to an open and positive atmosphere in the workplace.


 

Application

We would like to have your application and CV as soon as possible, but not later than June 12th, 2016. Your application will be handled by our Recruitment Specialist Martin Karlsson +46 736446120 or martin.karlsson@fingerprints.com.