Experienced Researcher Multichip Design

Ericsson AB

Join our Team

About this opportunity:
As an Experienced Researcher in IC Design and Multichip Integration, you will work with a motivated group of experts driving advancements in the System-on-Package domain. This unique position offers you the opportunity to work on diverse and exciting tasks—ranging from exploring emerging technologies to supporting Proof of Concepts (PoCs) for applications spanning from portable devices to high-power base stations. 

Your contributions will bridge the gap between System-on-Chip (SoC) and System-on-Package (SoP), helping to build Ericsson's future patent portfolio and shaping our research strategies. If you're a creative researcher passionate about innovation, this role is for you! 

What you will do:
An average week might include: 
* Conducting research studies, measurements, or computer simulations and effectively documenting and communicating results. 
* Creating new technical solutions and protecting them through Intellectual Property Rights (IPR). 
* Representing Ericsson in university collaborations, as well as in customer and supplier meetings. 
* Influencing Ericsson’s research strategies to help shape the future of our technologies. 
* Developing evaluation tools, demonstrators, or Proof of Concepts to validate new ideas. 
* Innovating within the fields of IC design, SoP, and multichip integration. 


The skills you bring:
Essential Qualifications: 
* A PhD in Integrated Circuit Design or an MS with equivalent relevant experience and publications. 
* Hands-on expertise in the design, layout, and measurement of Analog/RF/mmW circuits (e.g., LNA, Mixer, Filter, VCO, PLL, PA). 
* Proficiency with design tools and simulators such as Cadence Spectre, Virtuoso, Calibre, Momentum. 
* Solid analytical and problem-solving skills with the ability to address complex technical challenges. 


Preferred Skills and Experience: 
* Understanding of integration aspects, including chip integration, package/PCB technology, and package design and simulations. 
* Knowledge of RF IC transceiver architectures, system design, and tradeoffs for both device and base station applications. 
* Experience with tools like Ansys HFSS, Allegro, or equivalent for package and PCB design. 
* Familiar with system-level simulations using tools like Matlab or Simulink. 


Why Join Us ? 
* Work alongside a highly skilled, ambitious team of IC and package designers—all PhDs—dedicated to groundbreaking research and collaboration. 
* Innovation-Focused Environment: Contribute to creating pioneering technologies that push the boundaries of what's possible in System-on-Package. 
* Diverse and Impactful Work: From working on lab demonstrators to supporting long-term research strategies, your contributions will directly shape future technologies.