Packaging of RF Front-end Modules in Mobile Terminals

Huawei Gothenburg research center is now looking for an expert in high-density component integration in RF front-end modules in mobile terminals, which is the key driver in enabling low-cost and miniature to allow for the growing of frequency bands in cellular communication. As a technical expert, you are expected to technically lead and participate in innovation for RF front-end packaging research activities. You are also expected to analyse and define requirements in related products, which may require close cooperation with various stakeholders.
Responsibilities
Research on innovative solutions for RF front-end module packaging in smartphones and other terminal devices.
Research on improving component integration and robustness of RF front-end modules.
Research on thermal management of RF front-end modules.
Solving challenges in technology development to ensure that RF front-end modules meet product requirements in dimension, performance, EM shielding, etc.
Active participation in proposing, reviewing and evaluating innovative technical ideas.

Qualifications requirements
MSc or PhD in Electrical Engineering or equivalent background.
5+ years of experience in high-density packaging of RF front-end modules in mobile terminals.
Professional in EM simulation tools for reliability and thermal analysis.
Expertise in the following areas:
Flip-chip packaging of the power amplifier.
Thermal management of RF front-end modules.
Reliability analysis of RF front-end modules.
Double-sided packaging technology.
Should be able to work effectively in a multidisciplinary team with good communication skills.
Self-motivated with strong analytical and problem-solving skills.
Should be able to travel to Europe and China.


This is a full-time consultant position.
Please get in touch with Karin Persson if you have any questions.